VSC8574XKS-05
vs
VSC8258YMR
feature comparison
Part Life Cycle Code |
Transferred
|
End Of Life
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
BGA,
|
FCBGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
256
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Seated Height-Max |
1.8 mm
|
2.7 mm
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
5A002.A.1
|
Operating Temperature-Max |
|
110 °C
|
Operating Temperature-Min |
|
-40 °C
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare VSC8574XKS-05 with alternatives
Compare VSC8258YMR with alternatives