W25Q16CLZPIP vs W25Q16CVSSIP feature comparison

W25Q16CLZPIP Winbond Electronics Corp

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W25Q16CVSSIP Winbond Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SON SOIC
Package Description HVSON, SOLCC8,.25 0.208 INCH, GREEN, SOIC-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 50 MHz 80 MHz
Data Retention Time-Min 20 20
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-N8 S-PDSO-G8
Length 6 mm 5.28 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON SOP
Package Equivalence Code SOLCC8,.25 SOP8,.3
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.8 mm 2.16 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.018 mA 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 5 mm 5.28 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1

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Compare W25Q16CVSSIP with alternatives