XC17256DPD8C vs 5962-9561701MPA feature comparison

XC17256DPD8C AMD Xilinx

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5962-9561701MPA AMD Xilinx

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code DIP DIP
Package Description PLASTIC, DIP-8 DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 12 MHz 12.5 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T8 R-GDIP-T8
JESD-609 Code e0 e0
Length 9.3599 mm 10.16 mm
Memory Density 262144 bit 262144 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 256KX1 256KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5974 mm 5.08 mm
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.01 mA 0.01 mA
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Screening Level MIL-STD-883

Compare XC17256DPD8C with alternatives

Compare 5962-9561701MPA with alternatives