XC17256DPD8C vs W25Q80BLSNIP feature comparison

XC17256DPD8C AMD Xilinx

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W25Q80BLSNIP Winbond Electronics Corp

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC WINBOND ELECTRONICS CORP
Part Package Code DIP SOIC
Package Description PLASTIC, DIP-8 SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 12 MHz 50 MHz
I/O Type COMMON
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e0
Length 9.3599 mm 4.9 mm
Memory Density 262144 bit 8388608 bit
Memory IC Type CONFIGURATION MEMORY FLASH
Memory Width 1 8
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 262144 words 1048576 words
Number of Words Code 256000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX1 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5974 mm 1.75 mm
Standby Current-Max 0.00005 A 0.000005 A
Supply Current-Max 0.01 mA 0.018 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 2.3 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm 3.9 mm
Base Number Matches 2 1
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Programming Voltage 3 V
Serial Bus Type SPI
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

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