XC17256DPD8C
vs
W25Q80DVUXAE
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-8
|
USON-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
12 MHz
|
66 MHz
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-N8
|
| JESD-609 Code |
e0
|
|
| Length |
9.3599 mm
|
3 mm
|
| Memory Density |
262144 bit
|
8388608 bit
|
| Memory IC Type |
CONFIGURATION MEMORY
|
FLASH
|
| Memory Width |
1
|
8
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
262144 words
|
1048576 words
|
| Number of Words Code |
256000
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
256KX1
|
1MX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HVSON
|
| Package Equivalence Code |
DIP8,.3
|
SOLCC8,.12,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
225
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.5974 mm
|
0.6 mm
|
| Standby Current-Max |
0.00005 A
|
0.00006 A
|
| Supply Current-Max |
0.01 mA
|
0.025 mA
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
2 mm
|
| Base Number Matches |
2
|
1
|
| Data Retention Time-Min |
|
20
|
| Endurance |
|
100000 Write/Erase Cycles
|
| Programming Voltage |
|
3 V
|
| Screening Level |
|
AEC-Q100
|
| Serial Bus Type |
|
QSPI
|
| Type |
|
NOR TYPE
|
| Write Protection |
|
HARDWARE/SOFTWARE
|
|
|
|
Compare XC17256DPD8C with alternatives
Compare W25Q80DVUXAE with alternatives