XC1765EPDG8C
vs
5962-9471701MPX
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
XILINX INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-GDIP-T8
|
| JESD-609 Code |
e3
|
|
| Length |
9.3599 mm
|
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
CONFIGURATION MEMORY
|
CONFIGURATION MEMORY
|
| Memory Width |
1
|
1
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
64KX1
|
64KX1
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
4.5974 mm
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
|
5 MHz
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
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