XC1765EPDG8C vs XC1765EDD8B feature comparison

XC1765EPDG8C Rochester Electronics LLC

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XC1765EDD8B AMD Xilinx

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Pbfree Code No No
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC XILINX INC
Part Package Code DIP DIP
Package Description DIP, CERAMIC, DIP-8
Pin Count 8 8
Reach Compliance Code unknown compliant
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code R-PDIP-T8 R-CDIP-T8
JESD-609 Code e3 e0
Length 9.3599 mm 10.16 mm
Memory Density 65536 bit 65536 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64KX1 64KX1
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 250
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 4.5974 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Clock Frequency-Max (fCLK) 5 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP8,.3
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0015 A
Supply Current-Max 0.01 mA

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