XC2S100-5FG256I vs XCV100-6FGG256C feature comparison

XC2S100-5FG256I AMD Xilinx

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XCV100-6FGG256C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Pin Count 256 256
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Clock Frequency-Max 263 MHz 333 MHz
Combinatorial Delay of a CLB-Max 0.7 ns 0.6 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 600 600
Number of Equivalent Gates 100000 108904
Number of Inputs 180
Number of Logic Cells 2700
Number of Outputs 176
Number of Terminals 256 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 600 CLBS, 100000 GATES 600 CLBS, 108904 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm 17 mm
Base Number Matches 1 1
Package Description BGA,
Technology CMOS

Compare XC2S100-5FG256I with alternatives

Compare XCV100-6FGG256C with alternatives