XC2V250-4CSG144I vs XC2V250-5CS144C feature comparison

XC2V250-4CSG144I AMD Xilinx

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XC2V250-5CS144C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 12 X 12 MM, 0.80 MM PITCH, LEAD FREE, MO-216BAG-2, CSP-144 12 X 12 MM, 0.80 MM PITCH, MO-216BAG-2, CSP-144
Pin Count 144 144
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 650 MHz 750 MHz
Combinatorial Delay of a CLB-Max 0.44 ns 0.39 ns
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e1 e0
Length 12 mm 12 mm
Moisture Sensitivity Level 3 3
Number of CLBs 384 384
Number of Equivalent Gates 250000 250000
Number of Inputs 92 92
Number of Logic Cells 3456 3456
Number of Outputs 92 92
Number of Terminals 144 144
Organization 384 CLBS, 250000 GATES 384 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA144,13X13,32 BGA144,13X13,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 240
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 12 mm 12 mm
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

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