XC2V6000-5FF1152I vs XC3S2000-4VQ100C feature comparison

XC2V6000-5FF1152I AMD Xilinx

Buy Now Datasheet

XC3S2000-4VQ100C AMD Xilinx

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA QFP
Package Description 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 VQFP-100
Pin Count 1152 100
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 750 MHz
Combinatorial Delay of a CLB-Max 0.39 ns
JESD-30 Code S-PBGA-B1152 S-PQFP-G100
JESD-609 Code e0 e4
Length 35 mm 14 mm
Moisture Sensitivity Level 4 3
Number of CLBs 8448 192
Number of Equivalent Gates 6000000 50000
Number of Inputs 824
Number of Logic Cells 76032
Number of Outputs 824
Number of Terminals 1152 100
Organization 8448 CLBS, 6000000 GATES 192 CLBS, 50000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFQFP
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 1.2 mm
Supply Voltage-Max 1.575 V 1.26 V
Supply Voltage-Min 1.425 V 1.14 V
Supply Voltage-Nom 1.5 V 1.2 V
Surface Mount YES YES
Technology CMOS
Terminal Finish Tin/Lead (Sn63Pb37) NICKEL PALLADIUM GOLD
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm 14 mm
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC2V6000-5FF1152I with alternatives

Compare XC3S2000-4VQ100C with alternatives