XC3164-5PC84I vs XC3064A-7PCG84I feature comparison

XC3164-5PC84I AMD Xilinx

Buy Now Datasheet

XC3064A-7PCG84I AMD Xilinx

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC LCC
Package Description QCCJ, LDCC84,1.2SQ QCCJ,
Pin Count 84 84
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX. 120 I/OS; 688 FLIP-FLOPS; TYP. GATES = 4000 - 5500 MAX USABLE 4500 LOGIC GATES
Clock Frequency-Max 190 MHz 113 MHz
Combinatorial Delay of a CLB-Max 4.1 ns 5.1 ns
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e3
Length 29.3116 mm 29.3116 mm
Moisture Sensitivity Level 3 3
Number of CLBs 224 224
Number of Equivalent Gates 4000 3500
Number of Inputs 70
Number of Logic Cells 224
Number of Outputs 70
Number of Terminals 84 84
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 224 CLBS, 4000 GATES 224 CLBS, 3500 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.699 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29.3116 mm 29.3116 mm
Base Number Matches 1 1

Compare XC3164-5PC84I with alternatives

Compare XC3064A-7PCG84I with alternatives