XC3S4000-4FG1156C vs XC3S4000-4FGG1156C feature comparison

XC3S4000-4FG1156C AMD Xilinx

Buy Now Datasheet

XC3S4000-4FGG1156C AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA1156,34X34,40 35 X 35 MM, LEAD FREE, FBGA-1156
Pin Count 1156 1156
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 630 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B1156
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6912 6912
Number of Equivalent Gates 4000000 4000000
Number of Inputs 712 712
Number of Logic Cells 62208 62208
Number of Outputs 712 712
Number of Terminals 1156 1156
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 6912 CLBS, 4000000 GATES 6912 CLBS, 4000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA1156,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 1 1
Time@Peak Reflow Temperature-Max (s) 30

Compare XC3S4000-4FG1156C with alternatives

Compare XC3S4000-4FGG1156C with alternatives