XC3S5000-5FGG1156C vs XC2V6000-4FFG1152C feature comparison

XC3S5000-5FGG1156C AMD Xilinx

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XC2V6000-4FFG1152C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 35 X 35 MM, LEAD FREE, FBGA-1156 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
Pin Count 1156 1152
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 725 MHz 650 MHz
Combinatorial Delay of a CLB-Max 0.53 ns 0.44 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B1152
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 4
Number of CLBs 8320 8448
Number of Equivalent Gates 5000000 6000000
Number of Inputs 784 824
Number of Logic Cells 74880 76032
Number of Outputs 784 824
Number of Terminals 1156 1152
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 8320 CLBS, 5000000 GATES 8448 CLBS, 6000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 3.4 mm
Supply Voltage-Max 1.26 V 1.575 V
Supply Voltage-Min 1.14 V 1.425 V
Supply Voltage-Nom 1.2 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
ECCN Code 3A001.A.7.A

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