XC3S5000-5FGG1156C vs XC3S4000-4FGG900I feature comparison

XC3S5000-5FGG1156C AMD Xilinx

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XC3S4000-4FGG900I AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 35 X 35 MM, LEAD FREE, FBGA-1156 31 X 31 MM, LEAD FREE, FBGA-900
Pin Count 1156 900
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 725 MHz 630 MHz
Combinatorial Delay of a CLB-Max 0.53 ns 0.61 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B900
JESD-609 Code e1 e1
Length 35 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 8320 6912
Number of Equivalent Gates 5000000 4000000
Number of Inputs 784 633
Number of Logic Cells 74880 62208
Number of Outputs 784 633
Number of Terminals 1156 900
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 8320 CLBS, 5000000 GATES 6912 CLBS, 4000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 31 mm
Base Number Matches 1 1
ECCN Code 3A991.D
Factory Lead Time 25 Weeks

Compare XC3S5000-5FGG1156C with alternatives

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