XC3S5000-5FGG1156C vs XC3S4000-4VQ100I feature comparison

XC3S5000-5FGG1156C AMD Xilinx

Buy Now Datasheet

XC3S4000-4VQ100I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA QFP
Package Description 35 X 35 MM, LEAD FREE, FBGA-1156 VQFP-100
Pin Count 1156 100
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 725 MHz
Combinatorial Delay of a CLB-Max 0.53 ns
JESD-30 Code S-PBGA-B1156 S-PQFP-G100
JESD-609 Code e1 e0
Length 35 mm 14 mm
Moisture Sensitivity Level 3 3
Number of CLBs 8320 192
Number of Equivalent Gates 5000000 50000
Number of Inputs 784
Number of Logic Cells 74880
Number of Outputs 784
Number of Terminals 1156 100
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 8320 CLBS, 5000000 GATES 192 CLBS, 50000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFQFP
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 1.2 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm 14 mm
Base Number Matches 1 1

Compare XC3S5000-5FGG1156C with alternatives

Compare XC3S4000-4VQ100I with alternatives