XC4052XLA-09BG352I vs XC4044XL-3BG352I feature comparison

XC4052XLA-09BG352I AMD Xilinx

Buy Now Datasheet

XC4044XL-3BG352I AMD Xilinx

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-352 PLASTIC, BGA-352
Pin Count 352 352
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO USE 100000 GATES MAX USABLE 44000 LOGIC GATES
Clock Frequency-Max 227 MHz 166 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.6 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1936 1600
Number of Equivalent Gates 33000 27000
Number of Inputs 289 320
Number of Logic Cells 4598 1600
Number of Outputs 289 320
Number of Terminals 352 352
Organization 1936 CLBS, 33000 GATES 1600 CLBS, 27000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

Compare XC4052XLA-09BG352I with alternatives

Compare XC4044XL-3BG352I with alternatives