XC5VLX110-2FF1153I vs XC5VLX110-2FFG676I feature comparison

XC5VLX110-2FF1153I AMD Xilinx

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XC5VLX110-2FFG676I AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1153 BGA-676
Pin Count 1153 676
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.77 ns 0.77 ns
JESD-30 Code S-PBGA-B1153 S-PBGA-B676
JESD-609 Code e0 e1
Length 35 mm 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 8640 8640
Number of Inputs 800 440
Number of Logic Cells 110592 110592
Number of Outputs 800 440
Number of Terminals 1153 676
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8640 CLBS 8640 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1153,34X34,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 27 mm
Base Number Matches 1 1
Factory Lead Time 72 Weeks

Compare XC5VLX110-2FF1153I with alternatives

Compare XC5VLX110-2FFG676I with alternatives