XC5VLX220-1FFG1760C vs XC5VLX220-2FF1760C feature comparison

XC5VLX220-1FFG1760C AMD Xilinx

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XC5VLX220-2FF1760C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1760 BGA-1760
Pin Count 1760 1760
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.9 ns 0.77 ns
JESD-30 Code S-PBGA-B1760 S-PBGA-B1760
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 17280 17280
Number of Inputs 800 800
Number of Logic Cells 221184 221184
Number of Outputs 800 800
Number of Terminals 1760 1760
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 17280 CLBS 17280 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1760,42X42,40 BGA1760,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1

Compare XC5VLX220-1FFG1760C with alternatives

Compare XC5VLX220-2FF1760C with alternatives