XC5VLX30-1FF676C vs XC5VLX30-1FFV676C feature comparison

XC5VLX30-1FF676C AMD Xilinx

Buy Now Datasheet

XC5VLX30-1FFV676C AMD Xilinx

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description BGA-676 BGA-676
Pin Count 676
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 72 Weeks
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 2400 2400
Number of Inputs 400 400
Number of Logic Cells 30720 30720
Number of Outputs 400 400
Number of Terminals 676 676
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2400 CLBS 2400 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3 mm 3 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1

Compare XC5VLX30-1FF676C with alternatives

Compare XC5VLX30-1FFV676C with alternatives