XC6VLX365T-L1FF1156I
vs
XC6VLX365T-L1FFG1156I
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
35 X 35 MM, FBGA-1156
|
35 X 35 MM, LEAD FREE, FBGA-1156
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| Factory Lead Time |
12 Weeks
|
|
| Clock Frequency-Max |
1098 MHz
|
1098 MHz
|
| Combinatorial Delay of a CLB-Max |
5.87 ns
|
5.87 ns
|
| JESD-30 Code |
S-PBGA-B1156
|
S-PBGA-B1156
|
| JESD-609 Code |
e0
|
e1
|
| Length |
35 mm
|
35 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Inputs |
600
|
600
|
| Number of Logic Cells |
364032
|
364032
|
| Number of Outputs |
600
|
600
|
| Number of Terminals |
1156
|
1156
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1156,34X34,40
|
BGA1156,34X34,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.5 mm
|
3.5 mm
|
| Supply Voltage-Max |
0.93 V
|
0.93 V
|
| Supply Voltage-Min |
0.87 V
|
0.87 V
|
| Supply Voltage-Nom |
0.9 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
2
|
2
|
|
|
|