XC6VLX365T-L1FFG1156C vs XC6VLX365T-2FFG1156I feature comparison

XC6VLX365T-L1FFG1156C AMD Xilinx

Buy Now Datasheet

XC6VLX365T-2FFG1156I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 35 X 35 MM, LEAD FREE, FBGA-1156 35 X 35 MM, LEAD FREE, FBGA-1156
Pin Count 1156 1156
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1098 MHz 1286 MHz
Combinatorial Delay of a CLB-Max 5.87 ns 4.29 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B1156
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of Inputs 600 600
Number of Logic Cells 364032 364032
Number of Outputs 600 600
Number of Terminals 1156 1156
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA1156,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 0.93 V 1.05 V
Supply Voltage-Min 0.87 V 0.95 V
Supply Voltage-Nom 0.9 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 2 2

Compare XC6VLX365T-L1FFG1156C with alternatives

Compare XC6VLX365T-2FFG1156I with alternatives