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XC6VLX760-2FFG1760C vs XC6VLX760-2FF1760C feature comparison

XC6VLX760-2FFG1760C AMD Xilinx

Buy Now Datasheet

XC6VLX760-2FF1760C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 42.50 X 42.50 MM, FBGA-1760
Pin Count 1760 1760
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1286 MHz 1286 MHz
Combinatorial Delay of a CLB-Max 4.29 ns 4.29 ns
JESD-30 Code S-PBGA-B1760 S-PBGA-B1760
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of Inputs 1200 1200
Number of Logic Cells 758784 758784
Number of Outputs 1200 1200
Number of Terminals 1760 1760
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1760,42X42,40 BGA1760,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

Compare XC6VLX760-2FFG1760C with alternatives

Compare XC6VLX760-2FF1760C with alternatives