XC6VSX315T-3FFG1156C
vs
XC6VSX315T-2FFG1156I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
Package Description |
35 X 35 MM, LEAD FREE, FBGA-1156
|
35 X 35 MM, LEAD FREE, FBGA-1156
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
AMD
|
AMD
|
Clock Frequency-Max |
1412 MHz
|
1286 MHz
|
JESD-30 Code |
S-PBGA-B
|
S-PBGA-B1156
|
JESD-609 Code |
e1
|
e1
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of Inputs |
600
|
600
|
Number of Logic Cells |
314880
|
314880
|
Number of Outputs |
600
|
600
|
Number of Terminals |
1156
|
1156
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1156,34X34,40
|
BGA1156,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
3.5 mm
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
2
|
2
|
Factory Lead Time |
|
12 Weeks
|
Combinatorial Delay of a CLB-Max |
|
4.29 ns
|
Supply Voltage-Max |
|
1.05 V
|
Supply Voltage-Min |
|
0.95 V
|
|
|
|