XC7A100T-1FGG484I vs XQ7A100T-1FG484M feature comparison

XC7A100T-1FGG484I AMD Xilinx

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XQ7A100T-1FG484M AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Pin Count 484 484
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks
Clock Frequency-Max 1098 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 7925
Number of Inputs 285 285
Number of Logic Cells 101440 101440
Number of Outputs 285 285
Number of Terminals 484 484
Operating Temperature-Max 100 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 7925 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm
Base Number Matches 1 1
Package Description 23 X 23 MM, 1 MM PITCH, FBGA-484
Temperature Grade MILITARY

Compare XC7A100T-1FGG484I with alternatives

Compare XQ7A100T-1FG484M with alternatives