XC7A100T-2FGG676C vs XC7A100T-1FGG676C feature comparison

XC7A100T-2FGG676C AMD Xilinx

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XC7A100T-1FGG676C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Pin Count 676 676
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Clock Frequency-Max 1286 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 1.05 ns 1.27 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 7925 7925
Number of Inputs 300 300
Number of Logic Cells 101440 101440
Number of Outputs 300 300
Number of Terminals 676 676
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 7925 CLBS 7925 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1

Compare XC7A100T-2FGG676C with alternatives

Compare XC7A100T-1FGG676C with alternatives