XC7K480T-2FFG1156I vs XC7K480T-2FFG901E feature comparison

XC7K480T-2FFG1156I AMD Xilinx

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XC7K480T-2FFG901E AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Pin Count 1156 900
Reach Compliance Code compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1286 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B901
JESD-609 Code e1 e1
Length 35 mm 31 mm
Moisture Sensitivity Level 4 4
Number of CLBs 37325
Number of Inputs 400
Number of Logic Cells 477760
Number of Outputs 400
Number of Terminals 1156 901
Organization 37325 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA901,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.35 mm 3.35 mm
Supply Voltage-Max 1.03 V 1.03 V
Supply Voltage-Min 0.97 V 0.97 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 35 mm 31 mm
Base Number Matches 1 1
Package Description LEAD FREE, FBGA-900
Operating Temperature-Max 100 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC7K480T-2FFG1156I with alternatives

Compare XC7K480T-2FFG901E with alternatives