XC95288-20BG352C vs XC95216-10BG352I feature comparison

XC95288-20BG352C AMD Xilinx

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XC95216-10BG352I AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-352 BGA-352
Pin Count 352 352
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 50 MHz 66.7 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e0
JTAG BST YES YES
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 192 166
Number of Macro Cells 288 216
Number of Terminals 352 352
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 166 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 20 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.4 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

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