XCV1000-6BG560C vs 5962-9957401NUA feature comparison

XCV1000-6BG560C AMD Xilinx

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5962-9957401NUA AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-560 PLASTIC, BGA-560
Pin Count 560 560
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 333 MHz
Combinatorial Delay of a CLB-Max 0.6 ns 0.8 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3
Number of CLBs 6144 6144
Number of Equivalent Gates 1124022 1124022
Number of Inputs 404 404
Number of Logic Cells 27648 27648
Number of Outputs 404 404
Number of Terminals 560 560
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Organization 6144 CLBS, 1124022 GATES 1124022 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50 BGA560,31X31,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER MILITARY
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
Screening Level MIL-PRF-38535

Compare XCV1000-6BG560C with alternatives

Compare 5962-9957401NUA with alternatives