XPC823CZT66B2
vs
MPC604ERX180
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
|
Pin Count |
256
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991
|
|
HTS Code |
8542.31.00.01
|
|
Address Bus Width |
32
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
|
External Data Bus Width |
32
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B256
|
S-XBGA-B255
|
Length |
23 mm
|
|
Low Power Mode |
YES
|
|
Number of Terminals |
256
|
255
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.35 mm
|
|
Speed |
66 MHz
|
180 MHz
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
23 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
3
|
4
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
BGA255,16X16,50
|
Power Supplies |
|
2.5/3.3 V
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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