XPC823ZT50
vs
MPC604ERX333
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA,
|
BGA, BGA255,16X16,50
|
| Pin Count |
256
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
26
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
50 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-XBGA-B255
|
| Length |
23 mm
|
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
256
|
255
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.35 mm
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
4
|
| Package Equivalence Code |
|
BGA255,16X16,50
|
| Speed |
|
333 MHz
|
|
|
|
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