XR16V554IJ-F
vs
SC16C554BIB64
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
EXAR CORP
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
LCC
|
|
| Package Description |
GREEN, PLASTIC, LCC-68
|
QFP, QFP64,.47SQ,20
|
| Pin Count |
68
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
3
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
64 MHz
|
|
| Communication Protocol |
ASYNC, BIT
|
|
| Data Transfer Rate-Max |
0.5 MBps
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQFP-G64
|
| JESD-609 Code |
e3
|
|
| Length |
24.23 mm
|
|
| Low Power Mode |
NO
|
|
| Number of Serial I/Os |
4
|
|
| Number of Terminals |
68
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QFP
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
QFP64,.47SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max |
3.63 V
|
|
| Supply Voltage-Min |
2.97 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.23 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare XR16V554IJ-F with alternatives