Part Details for 10M16DAF256I8G by Intel Corporation
Overview of 10M16DAF256I8G by Intel Corporation
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Part Details for 10M16DAF256I8G
10M16DAF256I8G CAD Models
10M16DAF256I8G Part Data Attributes
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10M16DAF256I8G
Intel Corporation
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Datasheet
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10M16DAF256I8G
Intel Corporation
Field Programmable Gate Array,
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Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B256 | |
Length | 17 mm | |
Number of CLBs | 1000 | |
Number of Inputs | 178 | |
Number of Logic Cells | 16000 | |
Number of Outputs | 178 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1000 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 3.15 V | |
Supply Voltage-Min | 2.85 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | TSMC | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 17 mm |