Part Details for 10AX115N2F45I2SGE2 by Intel Corporation
Overview of 10AX115N2F45I2SGE2 by Intel Corporation
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for 10AX115N2F45I2SGE2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
10AX115N2F45I2SGE2-ND
|
DigiKey | IC FPGA 768 I/O 1932FBGA Lead time: 6 Weeks Container: Tray | Limited Supply - Call |
|
Buy Now |
Part Details for 10AX115N2F45I2SGE2
10AX115N2F45I2SGE2 CAD Models
10AX115N2F45I2SGE2 Part Data Attributes
|
|
10AX115N2F45I2SGE2
Intel Corporation
Buy Now
Datasheet
|
Compare Parts:
10AX115N2F45I2SGE2
Intel Corporation
Field Programmable Gate Array, PBGA1932, FBGA-1932
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1932 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B1932 | |
| Length | 45 mm | |
| Number of CLBs | 42720 | |
| Number of Terminals | 1932 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 42720 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 3.5 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 45 mm |