Part Details for 27C16Q450/883 by Texas Instruments
Overview of 27C16Q450/883 by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for 27C16Q450/883
27C16Q450/883 CAD Models
27C16Q450/883 Part Data Attributes
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27C16Q450/883
Texas Instruments
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Datasheet
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27C16Q450/883
Texas Instruments
2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERAMIC, DIP-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Package Description | WDIP, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 450 ns | |
| Additional Feature | TTL COMPATIBLE INPUTS/OUTPUTS | |
| JESD-30 Code | R-GDIP-T24 | |
| Memory Density | 16384 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 2KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.969 mm | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 27C16Q450/883
This table gives cross-reference parts and alternative options found for 27C16Q450/883. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C16Q450/883, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| ET2716Q | UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 | Teledyne e2v | 27C16Q450/883 vs ET2716Q |
| M2716 | UVPROM, 2KX8, 450ns, CMOS, PDIP24, DIP-24 | Intel Corporation | 27C16Q450/883 vs M2716 |
| AM2716-6DC | UVPROM, 2KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, DIP-24 | AMD | 27C16Q450/883 vs AM2716-6DC |
| LD2716 | UVPROM, 2KX8, 450ns, CMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | Intel Corporation | 27C16Q450/883 vs LD2716 |
| AM2716B-455DI | UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | 27C16Q450/883 vs AM2716B-455DI |
| NMC27C16-45 | IC 2K X 8 UVPROM, 450 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | National Semiconductor Corporation | 27C16Q450/883 vs NMC27C16-45 |
| MBM2716 | 2K X 8 UVPROM CARD, 450 ns, CDIP24, CERAMIC, DIP-24 | FUJITSU Limited | 27C16Q450/883 vs MBM2716 |
| AM2716B-450DC | UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | 27C16Q450/883 vs AM2716B-450DC |
| AM2716B-455DC | UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | 27C16Q450/883 vs AM2716B-455DC |
| AM2716B-450DI | UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | 27C16Q450/883 vs AM2716B-450DI |