Part Details for 53RS881ANS by AMD
Overview of 53RS881ANS by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 53RS881ANS
53RS881ANS CAD Models
53RS881ANS Part Data Attributes
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53RS881ANS
AMD
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Datasheet
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53RS881ANS
AMD
OTP ROM, 1KX8, 20ns, MOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 20 ns | |
| JESD-30 Code | R-PDIP-T24 | |
| Length | 31.242 mm | |
| Memory Density | 8192 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 1024 words | |
| Number of Words Code | 1000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 1KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Supply Current-Max | 0.18 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | MOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for 53RS881ANS
This table gives cross-reference parts and alternative options found for 53RS881ANS. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 53RS881ANS, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27S37ADCB | OTP ROM, 1KX8, 20ns, Bipolar, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | AMD | 53RS881ANS vs AM27S37ADCB |
| AM27S37APCB | OTP ROM, 1KX8, 20ns, Bipolar, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | AMD | 53RS881ANS vs AM27S37APCB |
| 5962-8863603LA | OTP ROM, 1KX8, 60ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | e2v technologies | 53RS881ANS vs 5962-8863603LA |
| CY7C235A-40DMB | OTP ROM, 1KX8, 20ns, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Cypress Semiconductor | 53RS881ANS vs CY7C235A-40DMB |
| 5962-8863603LX | OTP ROM, 1KX8, 20ns, CMOS, CDIP24, CERAMIC, DIP-24 | Cypress Semiconductor | 53RS881ANS vs 5962-8863603LX |
| CY7C235A-40PC | OTP ROM, 1KX8, 20ns, CMOS, PDIP24, 0.300 INCH, DIP-24 | Cypress Semiconductor | 53RS881ANS vs CY7C235A-40PC |
| CY7C235A-40PI | OTP ROM, 1KX8, 20ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | Cypress Semiconductor | 53RS881ANS vs CY7C235A-40PI |
| 5962-8863603LX | OTP ROM, 1KX8, 20ns, CMOS, CDIP24, CERAMIC, DIP-24 | e2v technologies | 53RS881ANS vs 5962-8863603LX |