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Part Details for 66AK2G12ABY60 by Texas Instruments
Overview of 66AK2G12ABY60 by Texas Instruments
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Available)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Security and Surveillance
Price & Stock for 66AK2G12ABY60
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
66AK2G12ABY60-ND
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DigiKey | GALILEO FLIPCHIP Min Qty: 60 Lead time: 6 Weeks Container: Tray | Temporarily Out of Stock |
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$44.9733 | Buy Now |
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DISTI #
595-66AK2G12ABY60
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC High performance multicore DSP+Arm - 1x Arm A15 cores, 1x C66x DSP core 625-FCCSP 0 to 90 RoHS: Compliant | 0 |
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$40.7500 / $50.3000 | Order Now |
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Bristol Electronics | 60 |
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RFQ | ||
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Ameya Holding Limited | 180 |
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RFQ |
Part Details for 66AK2G12ABY60
66AK2G12ABY60 CAD Models
66AK2G12ABY60 Part Data Attributes:
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66AK2G12ABY60
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
66AK2G12ABY60
Texas Instruments
High performance multicore DSP+Arm - 1x Arm A15 cores, 1x C66x DSP core 625-FCCSP 0 to 90
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | LFBGA, BGA625,25X25,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| JESD-30 Code | S-PBGA-B625 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 625 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA625,25X25,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.56 mm | |
| Supply Voltage-Max | 0.945 V | |
| Supply Voltage-Min | 0.855 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |
Alternate Parts for 66AK2G12ABY60
This table gives cross-reference parts and alternative options found for 66AK2G12ABY60. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 66AK2G12ABY60, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| X66AK2G12ABY60 | Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 625-FCBGA 0 to 70 | Texas Instruments | 66AK2G12ABY60 vs X66AK2G12ABY60 |