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3.3V 128Kx36 ZBT Synchronous PipeLined SRAM with 2.5V I/O, PBGA84/Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
71V2556SA133BGI-ND
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DigiKey | IC SRAM 4.5MBIT PAR 119PBGA Min Qty: 168 Lead time: 18 Weeks Container: Tray | Limited Supply - Call |
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$9.7020 | Buy Now |
DISTI #
71V2556SA133BGI
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Avnet Americas | 3.3V 128Kx36 ZBT Synchronous PipeLined SRAM with 2.5V I/O - Trays (Alt: 71V2556SA133BGI) RoHS: Not Compliant Min Qty: 168 Package Multiple: 84 Lead time: 36 Weeks, 0 Days Container: Tray | 0 |
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$8.0518 / $9.1930 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 168 Package Multiple: 84 Container: Tray | 0Tray |
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$7.9300 | Buy Now |
DISTI #
71V2556SA133BGI
|
Avnet Americas | 3.3V 128Kx36 ZBT Synchronous PipeLined SRAM with 2.5V I/O - Trays (Alt: 71V2556SA133BGI) RoHS: Not Compliant Min Qty: 168 Package Multiple: 84 Lead time: 36 Weeks, 0 Days Container: Tray | 0 |
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$8.0518 / $9.1930 | Buy Now |
DISTI #
71V2556SA133BGI
|
Avnet Silica | 3.3V 128Kx36 ZBT Synchronous PipeLined SRAM with 2.5V I/O (Alt: 71V2556SA133BGI) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 2 Weeks, 5 Days | Silica - 0 |
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Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
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71V2556SA133BGI
Renesas Electronics Corporation
Buy Now
Datasheet
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71V2556SA133BGI
Renesas Electronics Corporation
3.3V 128Kx36 ZBT Synchronous PipeLined SRAM with 2.5V I/O, PBGA84/Tray
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | PBGA | |
Package Description | BGA-119 | |
Pin Count | 119 | |
Manufacturer Package Code | BG119 | |
Reach Compliance Code | not_compliant | |
ECCN Code | NLR | |
HTS Code | 8542320041 | |
Factory Lead Time | 36 Weeks | |
Date Of Intro | 2020-08-25 | |
Samacsys Manufacturer | Renesas Electronics | |
Access Time-Max | 4.2 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 133 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B119 | |
JESD-609 Code | e0 | |
Length | 22 mm | |
Memory Density | 4718592 bit | |
Memory IC Type | ZBT SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA119,7X17,50 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Seated Height-Max | 2.36 mm | |
Standby Current-Max | 0.045 A | |
Standby Voltage-Min | 3.14 V | |
Supply Current-Max | 0.31 mA | |
Supply Voltage-Max (Vsup) | 3.465 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 14 mm |