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Part Details for 74FCT163373APAG by Renesas Electronics Corporation
Overview of 74FCT163373APAG by Renesas Electronics Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Aerospace and Defense
Energy and Power Systems
Healthcare
Price & Stock for 74FCT163373APAG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | 74FCT163373 - 3.3V CMOS 16-Bit Transparent Latch ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 1121 |
|
$1.0500 / $1.2400 | Buy Now |
Part Details for 74FCT163373APAG
74FCT163373APAG CAD Models
74FCT163373APAG Part Data Attributes:
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74FCT163373APAG
Renesas Electronics Corporation
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Datasheet
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74FCT163373APAG
Renesas Electronics Corporation
3.3V 16-Bit Transparent Latch, TSSOP39/Tube
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | TSSOP | |
| Pin Count | 48 | |
| Manufacturer Package Code | PAG48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | NLR | |
| HTS Code | 8542390001 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Additional Feature | MAX O/P SKEW = 0.5NS; TYP VOLP = 0.3V | |
| Family | FCT | |
| JESD-30 Code | R-PDSO-G48 | |
| JESD-609 Code | e3 | |
| Length | 12.5 mm | |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | BUS DRIVER | |
| Max I(ol) | 0.024 A | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 8 | |
| Number of Functions | 2 | |
| Number of Ports | 2 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | 3-STATE | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP48,.3,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Packing Method | TUBE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 5.2 ns | |
| Propagation Delay (tpd) | 8.5 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6.1 mm |