Part Details for 74LVC138ABQ-Q100X by NXP Semiconductors
Overview of 74LVC138ABQ-Q100X by NXP Semiconductors
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Applications
Consumer Electronics
Financial Technology (Fintech)
Computing and Data Storage
Telecommunications
Communication and Networking
Part Details for 74LVC138ABQ-Q100X
74LVC138ABQ-Q100X CAD Models
74LVC138ABQ-Q100X Part Data Attributes
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74LVC138ABQ-Q100X
NXP Semiconductors
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74LVC138ABQ-Q100X
NXP Semiconductors
74LVC138A-Q100 - 3-to-8 line decoder/demultiplexer; inverting QFN 16-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763-1, DHVQFN-16 | |
Pin Count | 16 | |
Manufacturer Package Code | SOT763-1 | |
Reach Compliance Code | compliant | |
Family | LVC/LCX/Z | |
Input Conditioning | STANDARD | |
JESD-30 Code | R-PQCC-N16 | |
Length | 3.5 mm | |
Logic IC Type | 3-LINE TO 8-LINE DECODER | |
Max I(ol) | 0.024 A | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Polarity | INVERTED | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC16,.1X.14,20 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Packing Method | TR | |
Prop. Delay@Nom-Sup | 7.5 ns | |
Propagation Delay (tpd) | 12.7 ns | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 2.5 mm |