Part Details for 74LVC2G126DP by NXP Semiconductors
Overview of 74LVC2G126DP by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Price & Stock for 74LVC2G126DP
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 5528 |
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RFQ | ||
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Bristol Electronics | 3000 |
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RFQ | ||
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Ameya Holding Limited | 15000 |
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RFQ | ||
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Sense Electronic Company Limited | TSSOP8 | 2500 |
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RFQ |
Part Details for 74LVC2G126DP
74LVC2G126DP CAD Models
74LVC2G126DP Part Data Attributes:
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74LVC2G126DP
NXP Semiconductors
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Datasheet
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74LVC2G126DP
NXP Semiconductors
IC LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, 3 MM, PLASTIC, SOT505-2, TSSOP-8, Bus Driver/Transceiver
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SOIC | |
| Package Description | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Control Type | ENABLE HIGH | |
| Family | LVC/LCX/Z | |
| JESD-30 Code | S-PDSO-G8 | |
| JESD-609 Code | e4 | |
| Length | 3 mm | |
| Load Capacitance (CL) | 50 pF | |
| Logic IC Type | BUS DRIVER | |
| Max I(ol) | 0.024 A | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 1 | |
| Number of Functions | 2 | |
| Number of Ports | 2 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | 3-STATE | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP8,.16 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Prop. Delay@Nom-Sup | 5.4 ns | |
| Propagation Delay (tpd) | 12.3 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3 mm |