Part Details for 93C86C-I/S15K by Microchip Technology Inc
Overview of 93C86C-I/S15K by Microchip Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for 93C86C-I/S15K
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
93C86C-I/S15K-ND
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DigiKey | IC EEPROM 16KBIT MICROWIRE DIE Lead time: 4 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
93C86C-I/S15K
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Microchip Technology Inc | 16k, 1024 X 16 OR 2048 X 8 SERIAL EE, Projected EOL: 2048-10-03 RoHS: Compliant pbFree: Yes |
0 Alternates Available |
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$0.4200 / $0.5000 | Buy Now |
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NAC | 16K, 1024 X 16 OR 2048 X 8 SERIAL EE DIE in WAFFLE PK IND, Package: 0 DICE WPAC - Action Code: NCNR RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
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RFQ |
Part Details for 93C86C-I/S15K
93C86C-I/S15K CAD Models
93C86C-I/S15K Part Data Attributes:
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93C86C-I/S15K
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
93C86C-I/S15K
Microchip Technology Inc
16k, 1024 X 16 OR 2048 X 8 SERIAL EE, -40C to +85C, Die-Waffle, WPAC
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | DICE | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Microchip | |
| Additional Feature | ALSO OPERATES WITH 1.8VMIN @1MHZ AND 2.5VMIN @2MHZ | |
| Alternate Memory Width | 8 | |
| Clock Frequency-Max (fCLK) | 3 MHz | |
| Data Retention Time-Min | 200 | |
| Endurance | 1000000 Write/Erase Cycles | |
| JESD-30 Code | R-XUUC-N | |
| Memory Density | 16384 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Words | 1024 words | |
| Number of Words Code | 1000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1KX16 | |
| Output Characteristics | TOTEM POLE | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Ready/Busy | YES | |
| Reverse Pinout | NO | |
| Screening Level | TS 16949 | |
| Serial Bus Type | MICROWIRE | |
| Standby Current-Max | 0.000001 A | |
| Supply Current-Max | 0.003 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Toggle Bit | YES | |
| Write Cycle Time-Max (tWC) | 2 ms | |
| Write Protection | SOFTWARE |