Part Details for AM27C256-150DI by Spansion
Overview of AM27C256-150DI by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for AM27C256-150DI
AM27C256-150DI CAD Models
AM27C256-150DI Part Data Attributes:
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AM27C256-150DI
Spansion
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Datasheet
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AM27C256-150DI
Spansion
UVPROM, 32KX8, 150ns, CMOS, CDIP28, CERAMIC, DIP-28
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SPANSION INC | |
Part Package Code | DIP | |
Package Description | CERAMIC, DIP-28 | |
Pin Count | 28 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 150 ns | |
JESD-30 Code | R-CDIP-T28 | |
Length | 37.1475 mm | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | WDIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.588 mm | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for AM27C256-150DI
This table gives cross-reference parts and alternative options found for AM27C256-150DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-150DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27C256-150DCB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-150DI vs AM27C256-150DCB |
AM27C256-150DCB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, DIP-28 | Spansion | AM27C256-150DI vs AM27C256-150DCB |
M27C256B-25XF3 | 32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C256-150DI vs M27C256B-25XF3 |
27C256-15I/J | 32K X 8 UVPROM, 150 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | AM27C256-150DI vs 27C256-15I/J |
AM27C256-150DI | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-150DI vs AM27C256-150DI |
TMS27C256-15JL4 | 32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C256-150DI vs TMS27C256-15JL4 |
CY27C256A-150WMB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Cypress Semiconductor | AM27C256-150DI vs CY27C256A-150WMB |
NM27C256QE150 | 32KX8 UVPROM, 150ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-150DI vs NM27C256QE150 |
AM27C256-155DIB | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-150DI vs AM27C256-155DIB |
CY27C256A-150WC | UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Cypress Semiconductor | AM27C256-150DI vs CY27C256A-150WC |