Part Details for AM27C256-205DC by AMD
Overview of AM27C256-205DC by AMD
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Price & Stock for AM27C256-205DC
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 22 |
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RFQ | ||
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 10 |
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$2.2500 / $4.5000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 4 |
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$3.7500 / $4.5000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 6 |
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$3.7500 / $4.5000 | Buy Now |
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Component Electronics, Inc | IN STOCK SHIP TODAY | 5 |
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$2.0000 / $3.0800 | Buy Now |
Part Details for AM27C256-205DC
AM27C256-205DC CAD Models
AM27C256-205DC Part Data Attributes:
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AM27C256-205DC
AMD
Buy Now
Datasheet
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Compare Parts:
AM27C256-205DC
AMD
UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | WDIP, DIP28,.6 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Length | 37.1475 mm | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.588 mm | |
Supply Current-Max | 0.05 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for AM27C256-205DC
This table gives cross-reference parts and alternative options found for AM27C256-205DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-205DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
AM27256-2DC | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | AM27C256-205DC vs AM27256-2DC |
NMC27C256BQE200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | AM27C256-205DC vs NMC27C256BQE200 |
AM27C256-200DE | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-205DC vs AM27C256-200DE |
NMC27C256Q20 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | Texas Instruments | AM27C256-205DC vs NMC27C256Q20 |
AM27C256-200DIB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 | Spansion | AM27C256-205DC vs AM27C256-200DIB |
AM27256-2DEB | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | AM27C256-205DC vs AM27256-2DEB |
AD27C256-200V10 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Intel Corporation | AM27C256-205DC vs AD27C256-200V10 |
AM27C256-205DI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C256-205DC vs AM27C256-205DI |
NMC27C256BQE200 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | AM27C256-205DC vs NMC27C256BQE200 |
TMS27C256-20JE | 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 | Texas Instruments | AM27C256-205DC vs TMS27C256-20JE |