| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LTC3246EMSE#TRPBF | Analog Devices | Wide VIN Rng Buck-Boost Ch Pum | |
| LTC3265EDHC#TRPBF | Analog Devices | L N 2x S w/ Boost & Inv Ch Pum | |
| LTC3265IFE#TRPBF | Analog Devices | L N 2x S w/ Boost & Inv Ch Pum |
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
ATMEL CORP
|
|
Part Package Code
|
DIP
|
|
Package Description
|
DIP, DIP8,.3
|
|
Pin Count
|
8
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
|
|
Samacsys Manufacturer
|
Microchip
|
|
Additional Feature
|
ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ
|
|
Clock Frequency-Max (fCLK)
|
0.4 MHz
|
|
Data Retention Time-Min
|
100
|
|
Endurance
|
1000000 Write/Erase Cycles
|
|
I2C Control Byte
|
1010DDDR
|
|
JESD-30 Code
|
R-PDIP-T8
|
|
JESD-609 Code
|
e3
|
|
Length
|
9.271 mm
|
|
Memory Density
|
2048 bit
|
|
Memory IC Type
|
EEPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
8
|
|
Number of Words
|
256 words
|
|
Number of Words Code
|
256
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
256X8
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
DIP
|
|
Package Equivalence Code
|
DIP8,.3
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
SERIAL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
5.334 mm
|
|
Serial Bus Type
|
I2C
|
|
Standby Current-Max
|
4e-7 A
|
|
Supply Current-Max
|
0.001 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
MATTE TIN
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
7.62 mm
|
|
Write Cycle Time-Max (tWC)
|
5 ms
|
|
Write Protection
|
HARDWARE
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| X76F640AET1 | Flash, 8KX8, PDSO8, 0.200 INCH, EIAJ, PLASTIC, SOIC-8 | Xicor Inc | AT24C02D-PUM vs X76F640AET1 |
| AT24C16D-MAHM-T | EEPROM, 2KX8, Serial, CMOS, PDSO8, 2 X 3 MM, 0.60 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, MO-229, UDFN-8 | Atmel Corporation | AT24C02D-PUM vs AT24C16D-MAHM-T |
| AT24C02C-MAHM-T | EEPROM, 256X8, Serial, CMOS, PDSO8, 2 X 3 MM, 0.50 MM PITCH, GREEN, MO-229, UDFN-8 | Atmel Corporation | AT24C02D-PUM vs AT24C02C-MAHM-T |
| AT25040B-XPD-T | EEPROM, 512X8, Serial, CMOS, PDSO8, 4.40 MM, HALOGEN AND LEAD FREE, PLASTIC, MO-153AA, TSSOP-8 | Atmel Corporation | AT24C02D-PUM vs AT25040B-XPD-T |
| X25F047V-5T1 | Flash, 512X8, PDSO8, PLASTIC, TSSOP-8 | Xicor Inc | AT24C02D-PUM vs X25F047V-5T1 |
| M28W160ECB70ZB1U | Flash, 1MX16, PBGA46, 6.39 X 6.37 MM, 0.75 MM PITCH, LEAD FREE, TFBGA-46 | Numonyx Memory Solutions | AT24C02D-PUM vs M28W160ECB70ZB1U |
| M25P10-AVMB3T/X | Flash, 2 X 3 MM, ROHS COMPLIANT, UFDFPN-8 | Numonyx Memory Solutions | AT24C02D-PUM vs M25P10-AVMB3T/X |
| WF128K32N-150HC5A | Flash Module, 512KX8, 150ns, CHIP66 | Microsemi Corporation | AT24C02D-PUM vs WF128K32N-150HC5A |
| AT25020B-MEHL-T | EEPROM, 256X8, Serial, CMOS, PDSO8, 1.80 X 2.20 MM, GREEN, XDFN-8 | Atmel Corporation | AT24C02D-PUM vs AT25020B-MEHL-T |
| X25F064S8I-5 | Flash, 8KX8, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | Xicor Inc | AT24C02D-PUM vs X25F064S8I-5 |
