Part Details for BSC9131NLE1HHHB by Freescale Semiconductor
Overview of BSC9131NLE1HHHB by Freescale Semiconductor
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Part Details for BSC9131NLE1HHHB
BSC9131NLE1HHHB CAD Models
BSC9131NLE1HHHB Part Data Attributes:
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BSC9131NLE1HHHB
Freescale Semiconductor
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BSC9131NLE1HHHB
Freescale Semiconductor
QorIQ Qonverge SoC, 800MHz StarCore DSP, 800MHz e500 CPU, MAPLE-B2F accelerator, DDR3, SEC, 0-105C
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | FBGA, | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 5A002.A | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B520 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 520 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 1.97 mm | |
| Speed | 800 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |