Part Details for BSC9131NLN1HHHB by NXP Semiconductors
Overview of BSC9131NLN1HHHB by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Transportation and Logistics
Healthcare
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for BSC9131NLN1HHHB
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
69W1226
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Newark | Qoriq Qonverge Soc, 800Mhz Starcore Dsp, 800Mhz E500 Cpu, Maple-B2F Accelerator, Ifc, Ddr3, 0-105C, Tray Multiple Dp Bakeable, Tray Rohs Compliant: Yes |Nxp BSC9131NLN1HHHB Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$42.8600 / $45.6000 | Buy Now |
|
DISTI #
BSC9131NLN1HHHB-ND
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DigiKey | IC MPU QORIQ 800MHZ 520FCBGA Lead time: 52 Weeks Container: Box | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
BSC9131NLN1HHHB
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Avnet Americas | DSP, STARCORE, 2 CORE - Trays (Alt: BSC9131NLN1HHHB) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Container: Tray | 0 |
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RFQ | |
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DISTI #
BSC9131NLN1HHHB
|
Avnet Americas | DSP, STARCORE, 2 CORE - Trays (Alt: BSC9131NLN1HHHB) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Container: Tray | 0 |
|
RFQ | |
|
DISTI #
4375782
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Farnell | MICROPROCESSORS IC'S RoHS: Compliant Min Qty: 60 Lead time: 3 Weeks, 1 Days Container: Reel | 15 |
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$81.2442 | Buy Now |
Part Details for BSC9131NLN1HHHB
BSC9131NLN1HHHB CAD Models
BSC9131NLN1HHHB Part Data Attributes:
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BSC9131NLN1HHHB
NXP Semiconductors
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BSC9131NLN1HHHB
NXP Semiconductors
RISC PROCESSOR
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FCBGA-520 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B520 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 520 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 1.97 mm | |
| Speed | 800 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |