Part Details for BU-63825D0-211Q by Data Device Corporation
Overview of BU-63825D0-211Q by Data Device Corporation
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Part Details for BU-63825D0-211Q
BU-63825D0-211Q CAD Models
BU-63825D0-211Q Part Data Attributes
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BU-63825D0-211Q
Data Device Corporation
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BU-63825D0-211Q
Data Device Corporation
Mil-Std-1553 Controller, 0.125MBps, CMOS, CDIP70, DIP-70
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Part Life Cycle Code | Active | |
Ihs Manufacturer | DATA DEVICE CORP | |
Package Description | DIP, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | ||
Boundary Scan | NO | |
Clock Frequency-Max | 16 MHz | |
Communication Protocol | MIL-STD-1553 | |
Data Encoding/Decoding Method | BIPH-LEVEL(MANCHESTER) | |
Data Transfer Rate-Max | 0.125 MBps | |
External Data Bus Width | ||
JESD-30 Code | R-CDIP-T70 | |
Length | 48.26 mm | |
Low Power Mode | YES | |
Number of Serial I/Os | ||
Number of Terminals | 70 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Screening Level | MIL-PRF-38534 | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 22.86 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |