Part Details for BU-63825F0-250K by Data Device Corporation
Overview of BU-63825F0-250K by Data Device Corporation
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- Part Data Attributes: (Available)
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Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| AD7663ACPZ | Analog Devices | 16-Bit, 250k SPS CMOS A/D Con | |
| AD7663ASTZ | Analog Devices | 16-Bit, 250k SPS CMOS A/D Con | |
| AD7610BSTZ-RL | Analog Devices | 16-BT Bipolar Pulsar ADC, 250K |
Part Details for BU-63825F0-250K
BU-63825F0-250K CAD Models
BU-63825F0-250K Part Data Attributes
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BU-63825F0-250K
Data Device Corporation
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BU-63825F0-250K
Data Device Corporation
Mil-Std-1553 Controller, 0.125MBps, CMOS, CQFP70, FLATPACK-70
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | DATA DEVICE CORP | |
| Package Description | QFF, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | WD-MAX | |
| Address Bus Width | ||
| Boundary Scan | NO | |
| Clock Frequency-Max | 16 MHz | |
| Communication Protocol | MIL-STD-1553 | |
| Data Encoding/Decoding Method | BIPH-LEVEL(MANCHESTER) | |
| Data Transfer Rate-Max | 0.125 MBps | |
| External Data Bus Width | ||
| JESD-30 Code | R-CQFP-F70 | |
| Length | 48.26 mm | |
| Low Power Mode | YES | |
| Number of Serial I/Os | ||
| Number of Terminals | 70 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QFF | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Screening Level | MIL-PRF-38534 | |
| Seated Height-Max | 5.46 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | FLAT | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 26 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |