Part Details for BU-63825F0-850Z by Data Device Corporation
Overview of BU-63825F0-850Z by Data Device Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for BU-63825F0-850Z
BU-63825F0-850Z CAD Models
BU-63825F0-850Z Part Data Attributes
|
BU-63825F0-850Z
Data Device Corporation
Buy Now
Datasheet
|
Compare Parts:
BU-63825F0-850Z
Data Device Corporation
Mil-Std-1553 Controller, 0.125MBps, CMOS, CQFP70, FLATPACK-70
|
Part Life Cycle Code | Active | |
Ihs Manufacturer | DATA DEVICE CORP | |
Package Description | QFF, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Additional Feature | WD-MAX | |
Address Bus Width | ||
Boundary Scan | NO | |
Clock Frequency-Max | 16 MHz | |
Communication Protocol | MIL-STD-1553 | |
Data Encoding/Decoding Method | BIPH-LEVEL(MANCHESTER) | |
Data Transfer Rate-Max | 0.125 MBps | |
External Data Bus Width | ||
JESD-30 Code | R-CQFP-F70 | |
Length | 48.26 mm | |
Low Power Mode | YES | |
Number of Serial I/Os | ||
Number of Terminals | 70 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QFF | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Screening Level | MIL-PRF-38534 | |
Seated Height-Max | 5.46 mm | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | FLAT | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 26 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |