Part Details for CXK58257P-12L by Sony Semiconductor
Overview of CXK58257P-12L by Sony Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (9 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for CXK58257P-12L
CXK58257P-12L CAD Models
CXK58257P-12L Part Data Attributes:
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CXK58257P-12L
Sony Semiconductor
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Datasheet
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CXK58257P-12L
Sony Semiconductor
Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SONY CORP | |
Package Description | 0.600 INCH, PLASTIC, DIP-28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 120 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PDIP-T28 | |
JESD-609 Code | e0 | |
Length | 36.8 mm | |
Memory Density | 262144 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5 mm | |
Standby Current-Max | 0.00005 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for CXK58257P-12L
This table gives cross-reference parts and alternative options found for CXK58257P-12L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CXK58257P-12L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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HY62256ALP-12 | Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | SK Hynix Inc | CXK58257P-12L vs HY62256ALP-12 |
SRM20256LC12 | Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, DIP-28 | S-MOS Systems | CXK58257P-12L vs SRM20256LC12 |
UPD43256AC-12L | 32KX8 STANDARD SRAM, 120ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Renesas Electronics Corporation | CXK58257P-12L vs UPD43256AC-12L |
HY62C256LP-12 | Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | SK Hynix Inc | CXK58257P-12L vs HY62C256LP-12 |
MS62256CL-12PC | Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Mosel Vitelic Corporation | CXK58257P-12L vs MS62256CL-12PC |
MCM60256AP12 | 32KX8 STANDARD SRAM, 120ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Motorola Mobility LLC | CXK58257P-12L vs MCM60256AP12 |
KM62256ALP-12 | Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Samsung Semiconductor | CXK58257P-12L vs KM62256ALP-12 |
LH52256L-12 | Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Sharp Corp | CXK58257P-12L vs LH52256L-12 |
HM62256LP-12 | Standard SRAM, 32KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Hitachi Ltd | CXK58257P-12L vs HM62256LP-12 |